Samtec ADM6 Series Vertical Surface PCB Header, 60 Contact(s), 0.635 mm Pitch, 4 Row, Shrouded
- RS Stock No.:
- 202-7907
- Mfr. Part No.:
- ADM6-60-01.5-L-4-2-A
- Manufacturer:
- Samtec
This image is representative of the product range
Currently unavailable
We don't know if this item will be back in stock, RS intend to remove it from our range soon.
- RS Stock No.:
- 202-7907
- Mfr. Part No.:
- ADM6-60-01.5-L-4-2-A
- Manufacturer:
- Samtec
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Samtec | |
| Product Type | PCB Header | |
| Series | ADM6 | |
| Pitch | 0.635mm | |
| Current | 1.34A | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Contacts | 60 | |
| Number of Rows | 4 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Surface | |
| Connector System | Board-to-Board | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -55°C | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | No | |
| Select all | ||
|---|---|---|
Brand Samtec | ||
Product Type PCB Header | ||
Series ADM6 | ||
Pitch 0.635mm | ||
Current 1.34A | ||
Housing Material Liquid Crystal Polymer | ||
Number of Contacts 60 | ||
Number of Rows 4 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Surface | ||
Connector System Board-to-Board | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Termination Type Solder | ||
Minimum Operating Temperature -55°C | ||
Contact Gender Male | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals No | ||
- COO (Country of Origin):
- US
The Samtec Connector is a low profile, ultra-slim surface mount header. Delivering 56 Gbps PAM4 performance, the ADM6 is compatible with the UMPT and UMPS series to provide flexible, two-piece power/signal solutions.
Incredibly dense with up to 240 total I/Os
Low profile 5 mm stack height and slim 5 mm width
4-row design; 10 - 60 positions per row (40 - 240 total positions)
Edge Rate® contact system optimized for signal integrity performance
Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
Solder ball technology for simplified processing and self aligning
Additional stack heights and higher pin counts in development
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