Molex 42375 Series Vertical Through Hole PCB Header, 10 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded
- RS Stock No.:
- 787-553
- Mfr. Part No.:
- 26-19-2101
- Manufacturer:
- Molex
Currently unavailable
We don't know if this item will be back in stock, RS intend to remove it from our range soon.
- RS Stock No.:
- 787-553
- Mfr. Part No.:
- 26-19-2101
- Manufacturer:
- Molex
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Molex | |
| Product Type | PCB Header | |
| Series | 42375 | |
| Current | 7A | |
| Pitch | 2.54mm | |
| Number of Contacts | 10 | |
| Housing Material | Nylon | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Wire-to-Board | |
| Contact Plating | Tin | |
| Contact Material | Brass | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Through Hole | |
| Maximum Operating Temperature | 105°C | |
| Contact Gender | Male | |
| Standards/Approvals | Ul | |
| Voltage | 250V | |
| Select all | ||
|---|---|---|
Brand Molex | ||
Product Type PCB Header | ||
Series 42375 | ||
Current 7A | ||
Pitch 2.54mm | ||
Number of Contacts 10 | ||
Housing Material Nylon | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Wire-to-Board | ||
Contact Plating Tin | ||
Contact Material Brass | ||
Minimum Operating Temperature -40°C | ||
Termination Type Through Hole | ||
Maximum Operating Temperature 105°C | ||
Contact Gender Male | ||
Standards/Approvals Ul | ||
Voltage 250V | ||
- COO (Country of Origin):
- IN
The Molex Wire to board header designed for efficient connectivity in various applications, featuring a reliable round pin configuration with a Compact design for easy integration into your projects.
Supports multiple connector types for versatile applications
Engineered for high-speed data transfer and reliable performance
Robust construction to withstand harsh environments
Facilitates efficient connections in space-constrained designs
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