Molex 3099 Series Vertical Through Hole PCB Header, 7 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded
- RS Stock No.:
- 787-519
- Mfr. Part No.:
- 22-15-2076
- Manufacturer:
- Molex
N
Subtotal (1 tray of 400 units)*
PHP27,740.44
(exc. VAT)
PHP31,069.29
(inc. VAT)
FREE delivery for orders over ₱3,000.00
Stocked by manufacturer
- Ready to ship from September 30, 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Tray(s) | Per Tray | Per Unit* |
|---|---|---|
| 1 + | PHP27,740.44 | PHP69.351 |
*price indicative
- RS Stock No.:
- 787-519
- Mfr. Part No.:
- 22-15-2076
- Manufacturer:
- Molex
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Molex | |
| Product Type | PCB Header | |
| Series | 3099 | |
| Current | 2.5A | |
| Pitch | 2.54mm | |
| Housing Material | Nylon | |
| Number of Contacts | 7 | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Plating | Tin | |
| Contact Material | Brass | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Through Hole | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 105°C | |
| Voltage | 500V | |
| Select all | ||
|---|---|---|
Brand Molex | ||
Product Type PCB Header | ||
Series 3099 | ||
Current 2.5A | ||
Pitch 2.54mm | ||
Housing Material Nylon | ||
Number of Contacts 7 | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Plating Tin | ||
Contact Material Brass | ||
Minimum Operating Temperature -40°C | ||
Termination Type Through Hole | ||
Contact Gender Male | ||
Maximum Operating Temperature 105°C | ||
Voltage 500V | ||
- COO (Country of Origin):
- MY
The Molex Board Connector provides a High performance Interface for complex PCB assemblies and High density electronic systems. This precision-engineered component facilitates stable signal transmission while its specialized orientation allows for efficient vertical stacking or perpendicular board integration to maximise internal enclosure space.
Constructed with high-quality materials for durability and longevity
Provides excellent electrical performance with minimal signal loss
Supports a variety of configurations to meet diverse connectivity needs
Designed to withstand challenging environmental conditions
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