Molex 43879 Series Vertical Through Hole PCB Header, 10 Contact(s), 4.20 mm Pitch, 2 Row, Shrouded

Subtotal (1 tray of 20 units)*

PHP19,884.61

(exc. VAT)

PHP22,270.76

(inc. VAT)

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Per Unit*
1 +PHP19,884.61PHP994.231

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SEA- RSPROC&C-PDP-1025
RS Stock No.:
694-074
Mfr. Part No.:
43879-0058
Manufacturer:
Molex
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Brand

Molex

Product Type

PCB Header

Series

43879

Pitch

4.20mm

Current

8A

Number of Contacts

10

Housing Material

High Temperature Thermoplastic

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

Board to Board Connectivity

Contact Material

Brass Alloy Bronze Alloy

Contact Plating

Gold

Termination Type

Through Hole

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

105°C

Tail Pin Length

6.25mm

Standards/Approvals

CSA LR19980, UL E29179

Voltage

600V

COO (Country of Origin):
MX
The Molex Mini-Fit BMI Header is engineered for reliable board-to-board and wire-to-board connections, featuring a compliant pin Interface in a dual row configuration. Designed with 10 circuits and equipped with 0.76μm gold selective contact plating and tin press-fit tail plating, this header ensures superior conductivity and durability. Its robust design supports a maximum voltage of 600V AC/DC and allows for mating cycles of up to 30, making it Ideal for demanding electrical applications. The versatile use of high-temperature thermoplastic resin enhances thermal stability, while the vertical orientation optimizes installation in Compact spaces. Whether for new designs or as a replacement, this product consistently delivers performance and longevity in various electronic contexts.

Fully shrouded design ensures safe handling and prevents misaligned connections
Net weight of 5.289g allows for lightweight integration into various applications
PCB retention features provide secure mounting on electronic boards
Operating temperature range of -40° to +105°C ensures versatility in diverse environments
Compatible with multiple mate parts, allowing flexible system design configurations

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