Molex 87758 Series Vertical Through Hole PCB Header, 18 Contact(s), 2 mm Pitch, 2 Row, Unshrouded

Subtotal (1 tray of 120 units)*

PHP19,454.87

(exc. VAT)

PHP21,789.45

(inc. VAT)

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Per Unit*
1 +PHP19,454.87PHP162.124

*price indicative

SEA- RSPROC&C-PDP-1025
RS Stock No.:
691-372
Mfr. Part No.:
87758-1816
Manufacturer:
Molex
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Brand

Molex

Product Type

PCB Header

Series

87758

Current

2A

Pitch

2mm

Number of Contacts

18

Housing Material

Nylon

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Through Hole

Connector System

Board-to-Board

Contact Material

Phosphor Bronze

Contact Plating

Tin

Termination Type

Through Hole

Minimum Operating Temperature

-55°C

Tail Pin Length

2.60mm

Maximum Operating Temperature

105°C

Contact Gender

Male

Standards/Approvals

UL E29179

Voltage

125V

COO (Country of Origin):
ID
The Molex Milli Grid Header is engineered for reliable board-to-board connections in various electronic applications. With a Compact 2.00mm pitch and 18 circuits, this through-hole vertical header provides optimal performance while maintaining a lead-free composition. Its selective gold plating ensures exceptional conductivity and durability, allowing it to withstand a significant number of mating cycles. This product is packaged in a user-friendly pocket tray, making it easy to handle and integrate into a wide range of PCB designs. Designed for versatility, it is well-suited for applications where space is at a premium, while delivering consistent reliability.

Compact 2.00mm pitch design optimises space utilisation on PCBs
18 circuits support efficient connection options for board-to-board applications
Lead-free construction aligns with modern compliance standards
Selective gold plating enhances electrical performance and longevity
Rated for a maximum current of 2.0A and a voltage of 125V for high-performance systems
Durable with a mating cycle durability rating of 100, ensuring dependable operation
Black resin material adds aesthetic appeal while providing structural integrity
Designed with a vertical orientation for straightforward integration into PCBs

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