Phoenix Contact DD32H Series Wave Soldering Mount PCB Header, 10 Contact(s), 5.08 mm Pitch, 2 Row, Shrouded

Subtotal (1 pack of 50 units)*

PHP18,574.01

(exc. VAT)

PHP20,802.89

(inc. VAT)

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SEA- RSPROC&C-PDP-1025
RS Stock No.:
492-938
Mfr. Part No.:
1378277
Manufacturer:
Phoenix Contact
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Brand

Phoenix Contact

Product Type

PCB Header

Series

DD32H

Pitch

5.08mm

Current

8A

Number of Contacts

10

Housing Material

Polybutylene Terephthalate

Number of Rows

2

Shrouded/Unshrouded

Shrouded

Connector System

CONNEXIS

Mount Type

Wave Soldering Mount

Contact Material

Copper Alloy

Contact Plating

Tin Plated

Termination Type

Crimp

Row Pitch

5.08mm

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

105°C

Contact Gender

Male

Tail Pin Length

3.8mm

Mating Pin Length

3.8mm

Standards/Approvals

No

Voltage

32 V

COO (Country of Origin):
CN
The Phoenix Contact PCB header is designed for versatility and reliability in various applications. This product guarantees seamless integration with PCB layouts thanks to its innovative linear pinning and compact design. The robust construction supports a nominal current of 8 A and a rated voltage up to 320 V, making it suitable for demanding environments. With its intuitively designed snap-in locking mechanism, the header ensures a secure connection, preventing accidental disconnections. Coupled with wave soldering mounting techniques, it simplifies the assembly process while upholding standards of quality and performance. This PCB header is ideal for engineers and designers seeking a reliable solution to enhance circuit board functionality.

Well-suited for multi-row configurations

Designed to facilitate effortless PCB replacement

Compliant with international standards for safety and reliability

Offers a unique locking mechanism for enhanced connection security

Constructed from materials that withstand temperature variations

Proven performance in a range of electrical and mechanical tests

Compact size optimises space on the PCB

Available in bulk packaging to meet project demands

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