Phoenix Contact MSTBV Series Straight Wave Soldering Mount PCB Header, 19 Contact(s), 5.08 mm Pitch, 1 Row, Shrouded
- RS Stock No.:
- 489-057
- Mfr. Part No.:
- 1808638
- Manufacturer:
- Phoenix Contact
Subtotal (1 pack of 50 units)*
PHP29,789.90
(exc. VAT)
PHP33,364.69
(inc. VAT)
FREE delivery for orders over ₱3,000.00
Temporarily out of stock
- Shipping from February 02, 2026
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Pack(s) | Per Pack | Per Unit* |
|---|---|---|
| 1 + | PHP29,789.90 | PHP595.798 |
*price indicative
- RS Stock No.:
- 489-057
- Mfr. Part No.:
- 1808638
- Manufacturer:
- Phoenix Contact
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Phoenix Contact | |
| Product Type | PCB Header | |
| Series | MSTBV | |
| Pitch | 5.08mm | |
| Current | 12A | |
| Housing Material | Polybutylene Terephthalate | |
| Number of Contacts | 19 | |
| Number of Rows | 1 | |
| Orientation | Straight | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | COMBICON MSTB 2.5 | |
| Mount Type | Wave Soldering Mount | |
| Contact Plating | Tin Plated | |
| Contact Material | Copper Alloy | |
| Row Pitch | 5.08mm | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -40°C | |
| Tail Pin Length | 3.9mm | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | CSA, cULus, EN ISO 22479:2022-06, IEC 60068-2-70:1995-12, IEC 60068-2-82/JEDEC JESD 201, IEC 60112, IEC 60512-1-1:2002-02, IEC 60512-1-2:2002-02, IEC 60512-13-5:2006-02, IEC 60512-15-1:2008-05, IEC 60512-3-1:2002-02, IEC 60512-5-1:2002-02, IEC 60664-1:2007-04, UL 94 V0, VDE | |
| Mating Pin Length | 3.9mm | |
| Voltage | 32 V | |
| Select all | ||
|---|---|---|
Brand Phoenix Contact | ||
Product Type PCB Header | ||
Series MSTBV | ||
Pitch 5.08mm | ||
Current 12A | ||
Housing Material Polybutylene Terephthalate | ||
Number of Contacts 19 | ||
Number of Rows 1 | ||
Orientation Straight | ||
Shrouded/Unshrouded Shrouded | ||
Connector System COMBICON MSTB 2.5 | ||
Mount Type Wave Soldering Mount | ||
Contact Plating Tin Plated | ||
Contact Material Copper Alloy | ||
Row Pitch 5.08mm | ||
Termination Type Solder | ||
Minimum Operating Temperature -40°C | ||
Tail Pin Length 3.9mm | ||
Contact Gender Male | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals CSA, cULus, EN ISO 22479:2022-06, IEC 60068-2-70:1995-12, IEC 60068-2-82/JEDEC JESD 201, IEC 60112, IEC 60512-1-1:2002-02, IEC 60512-1-2:2002-02, IEC 60512-13-5:2006-02, IEC 60512-15-1:2008-05, IEC 60512-3-1:2002-02, IEC 60512-5-1:2002-02, IEC 60664-1:2007-04, UL 94 V0, VDE | ||
Mating Pin Length 3.9mm | ||
Voltage 32 V | ||
- COO (Country of Origin):
- DE
The Phoenix Contact PCB header is designed to meet the high demands of modern electronic device connections. The MSTBV 2.5/19-GEH-5.08 model provides a robust solution with exceptional flexibility in device design. Its green PBT housing houses precision-engineered contacts that ensure reliable connectivity across various applications. The product's thoughtful design facilitates easy mounting through wave soldering, while the linear pinning layout enhances multi-row arrangement on circuit boards. With a nominal current of 12 A and a rated voltage of up to 320 V, this PCB header stands out for its performance and reliability, making it an ideal choice for engineers seeking efficiency without compromise. The quality manufacturing ensures durability even in challenging environments, further reinforcing its place in the realm of dependable connectivity.
Offers versatility for various connection technologies
Facilitates straightforward installation with wave soldering
Enables compact multi-row configurations on PCBs
Constructed with WEEE/RoHS-compliant materials
Features a durable tin-plated contact surface
Designed for use in temperature ranges from -40 °C to 105 °C
Complies with international standards for quality and safety
Lightweight construction for efficient handling and assembly
Supports high-frequency applications with minimal signal loss
Allows for easy integration into existing system designs
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