Phoenix Contact IPC Series Wave Soldering Mount PCB Header, 7 Contact(s), 10.16 mm Pitch, 1 Row, Shrouded

Subtotal (1 pack of 50 units)*

PHP104,947.35

(exc. VAT)

PHP117,541.03

(inc. VAT)

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1 +PHP104,947.35PHP2,098.947

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SEA- RSPROC&C-PDP-1025
RS Stock No.:
483-707
Mfr. Part No.:
1969661
Manufacturer:
Phoenix Contact
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Brand

Phoenix Contact

Series

IPC

Product Type

PCB Header

Current

76A

Pitch

10.16mm

Number of Contacts

7

Housing Material

Polyamide

Number of Rows

1

Shrouded/Unshrouded

Shrouded

Connector System

COMBICON PC 6 hybrid

Mount Type

Wave Soldering Mount

Contact Material

Copper Alloy

Contact Plating

Silver

Minimum Operating Temperature

-40°C

Row Pitch

10.16mm

Termination Type

Solder

Tail Pin Length

4mm

Maximum Operating Temperature

105°C

Contact Gender

Female

Standards/Approvals

cULus Recognised, VDE

Mating Pin Length

4mm

Voltage

1000 V

COO (Country of Origin):
PL
The Phoenix Contact PCB header is designed for versatile usage, offering an effective solution for connecting devices across various applications. The inverted design allows for touch-proof outputs and PCB-to-PCB connections, ensuring safety and functionality. Engineered with high-quality materials, this product ensures reliable performance, with a robust construction that withstands environmental challenges. Its screw locking mechanism enhances mechanical stability, making it suitable for demanding installations. The connectors are compatible with various connection technologies, providing maximum flexibility in device design. Moreover, the integrated double steel spring adds an extra layer of safety, adapting to power fluctuations effortlessly, making this a prime choice for developers looking to optimise their devices.

Offers well-known mounting principles for global applicability

Compatible with multiple connection technologies for design flexibility

Inverted header configuration enhances safety in operational environments

Screwable flange provides superior mechanical stability

Double steel spring mitigates risks associated with temperature and power fluctuations

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