onsemi QFET Type N-Channel MOSFET, 10 A, 100 V Enhancement, 3-Pin TO-252 FQD13N10LTM

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Subtotal (1 pack of 5 units)*

PHP237.16

(exc. VAT)

PHP265.62

(inc. VAT)

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Units
Per Unit
Per Pack*
5 - 20PHP47.432PHP237.16
25 - 95PHP45.976PHP229.88
100 - 245PHP44.134PHP220.67
250 - 495PHP42.29PHP211.45
500 +PHP40.828PHP204.14

*price indicative

Packaging Options:
RS Stock No.:
671-0952
Mfr. Part No.:
FQD13N10LTM
Manufacturer:
onsemi
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Brand

onsemi

Product Type

MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

10A

Maximum Drain Source Voltage Vds

100V

Package Type

TO-252

Series

QFET

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

180mΩ

Channel Mode

Enhancement

Maximum Power Dissipation Pd

2.5W

Maximum Gate Source Voltage Vgs

20 V

Minimum Operating Temperature

-55°C

Typical Gate Charge Qg @ Vgs

8.7nC

Forward Voltage Vf

1.5V

Maximum Operating Temperature

150°C

Width

6.1 mm

Height

2.3mm

Standards/Approvals

No

Length

6.6mm

Automotive Standard

No

COO (Country of Origin):
MY

QFET® N-Channel MOSFET, 6A to 10.9A, Fairchild Semiconductor


Fairchild Semiconductor’s new QFET® Planar MOSFETs use advanced, proprietary technology to offer best-in-class operating performance for a wide range of applications, including power supplies, PFC (Power Factor Correction), DC-DC Converters, Plasma Display Panels (PDP), lighting ballasts, and motion control.

They offer reduced on-state loss by lowering on-resistance (RDS(on)), and reduced switching loss by lowering gate charge (Qg) and output capacitance (Coss). By using Advanced QFET® process technology, Fairchild can offer an improved figure of merit (FOM) over competing Planar MOSFET devices.

MOSFET Transistors, ON Semi


ON Semi offers a substantial portfolio of MOSFET devices that includes high-voltage (>250V) and low-voltage (<250V) types. The Advanced silicon technology provides smaller die sizes, which it is incorporated into multiple industry-standard and thermally-enhanced packages.

ON Semi MOSFETs provide superior design reliability from reduced voltage spikes and overshoot, to lower junction capacitance and reverse recovery charge, to elimination of additional external components to keep systems up and running longer.

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