Infineon HEXFET Type P-Channel MOSFET, 7.2 A, 20 V Enhancement, 6-Pin PQFN IRLHS2242TRPBF

RS Stock No.:: 130-1018
Mfr. Part No.:: IRLHS2242TRPBF
Manufacturer:: Infineon

Infineon HEXFET Type P-Channel MOSFET, 7.2 A, 20 V Enhancement, 6-Pin PQFN IRLHS2242TRPBF

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Subtotal (1 pack of 25 units)*

PHP465.50

(exc. VAT)

PHP521.25

(inc. VAT)

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Last RS stock

Final 26,725 unit(s), ready to ship from another location

Units	Per Unit	Per Pack*
25 - 100	PHP18.62	PHP465.50
125 - 475	PHP18.061	PHP451.53
500 - 975	PHP17.519	PHP437.98
1000 - 2475	PHP16.994	PHP424.85
2500 +	PHP16.484	PHP412.10

*price indicative

RS Stock No.:: 130-1018
Mfr. Part No.:: IRLHS2242TRPBF
Manufacturer:: Infineon

Specifications

Technical data sheets

Legislation and Compliance

Product Details

Find similar products by selecting one or more attributes.

Select all	Attribute	Value
	Brand	Infineon
	Channel Type	Type P
	Product Type	MOSFET
	Maximum Continuous Drain Current Id	7.2A
	Maximum Drain Source Voltage Vds	20V
	Package Type	PQFN
	Series	HEXFET
	Mount Type	Surface
	Pin Count	6
	Maximum Drain Source Resistance Rds	53mΩ
	Channel Mode	Enhancement
	Forward Voltage Vf	-1.2V
	Maximum Power Dissipation Pd	9.6W
	Minimum Operating Temperature	-55°C
	Maximum Gate Source Voltage Vgs	12 V
	Typical Gate Charge Qg @ Vgs	12nC
	Maximum Operating Temperature	150°C
	Height	0.95mm
	Width	2.1 mm
	Standards/Approvals	No
	Length	2.1mm
	Automotive Standard	No
	Distrelec Product Id	304-36-993

	Select all
	Brand Infineon
	Channel Type Type P
	Product Type MOSFET
	Maximum Continuous Drain Current Id 7.2A
	Maximum Drain Source Voltage Vds 20V
	Package Type PQFN
	Series HEXFET
	Mount Type Surface
	Pin Count 6
	Maximum Drain Source Resistance Rds 53mΩ
	Channel Mode Enhancement
	Forward Voltage Vf -1.2V
	Maximum Power Dissipation Pd 9.6W
	Minimum Operating Temperature -55°C
	Maximum Gate Source Voltage Vgs 12 V
	Typical Gate Charge Qg @ Vgs 12nC
	Maximum Operating Temperature 150°C
	Height 0.95mm
	Width 2.1 mm
	Standards/Approvals No
	Length 2.1mm
	Automotive Standard No
	Distrelec Product Id 304-36-993

Infineon HEXFET Series MOSFET, 7.2A Maximum Continuous Drain Current, 9.6W Maximum Power Dissipation - IRLHS2242TRPBF

This surface mount MOSFET is suitable for applications that demand high-efficiency switching. Its low on-resistance, paired with HEXFET technology, contributes to minimal power loss, making it appropriate for power management tasks within various electronic circuits. With a maximum temperature rating ranging from -55°C to +150°C, it operates effectively in challenging conditions.

Features & Benefits

• Low Rds(on) ensures high efficiency and reduced heat generation

• Capable of handling continuous drain current of 7.2A for robust performance

• Compact 6-pin DFN package facilitates easy integration into limited spaces

• Enhancement mode operation allows for versatile design options

• Provides excellent thermal resistance for improved longevity

Applications

• Used for system/load switching in automation systems

• Ideal for charge and discharge switching in battery management

• Suitable for Compact electronic devices requiring high efficiency

• Employed in electrical control systems and power management circuits

What is the significance of the low Rds(on) feature?

The low Rds(on) feature leads to reduced conduction losses, enhancing overall efficiency and maintaining lower temperatures during operation, which is VITAL for high power applications.

How does this component manage thermal performance?

It has a maximum temperature rating of +150°C, along with low thermal resistance to improve heat dissipation, ensuring stable operation under high-load conditions.

Can it handle varying operational environments?

Yes, it functions effectively across a temperature range of -55°C to +150°C, making it suitable for rigorous applications in diverse climates.

Is it suitable for high-frequency applications?

The MOSFET's design supports high-speed switching, making it effective for high-frequency applications in contemporary electronics.

What are the mounting requirements for optimal performance?

For best outcomes, it should be mounted on a PCB with adequate thermal management features to optimise heat dissipation and electrical connections.