TDK 4.7 μF Multilayer Ceramic Capacitor, 25V dc, ±10 %, Surface

This image is representative of the product range

Subtotal (1 reel of 2000 units)*

PHP9,302.00

(exc. VAT)

PHP10,418.00

(inc. VAT)

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Units
Per Unit
Per Reel*
2000 +PHP4.651PHP9,302.00

*price indicative

RS Stock No.:
921-4129
Mfr. Part No.:
C2012X5R1E475K125AB
Manufacturer:
TDK
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Brand

TDK

Capacitance

4.7μF

Product Type

Multilayer Ceramic Capacitor

Voltage

25V dc

Package/Case

0805

Mount Type

Surface

Packaging

Tape & Reel

Dielectric

X5R

Tolerance

±10 %

Automotive Standard

No

Termination Type

Surface Mount

Minimum Operating Temperature

-55°C

Series

C

Height

1.25mm

Standards/Approvals

No

Width

1.25mm

Length

2mm

Maximum Operating Temperature

85°C

COO (Country of Origin):
JP

TDK C Type 0805 Series, X5R Dielectric


TDK C Series of general purpose multilayer ceramic chip capacitors suited for high frequency and high density type power suppliers.

Features and Benefits:


High capacitance through precision technologies that enable the use of multiple thinner ceramic dielectric layers

A monolithic structure ensures superior mechanical strength and reliability

Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values

Low self-heating and high ripple resistance due to low ESR

Applications


Commercial Grade for general applications including

General electronic equipment; Mobile communication equipment; Power supply circuit; Office automation equipment; TV, LED displays; Servers, PCs, Notebooks, Tablets

0805 Range


Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.

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