TDK 10 μF Multilayer Ceramic Capacitor, 50V dc, ±10 %, Surface
- RS Stock No.:
- 788-3082P
- Mfr. Part No.:
- CGA6P3X7S1H106K250AB
- Manufacturer:
- TDK
This image is representative of the product range
Bulk discount available
View bulk pricing optionsSubtotal 50 units (supplied on a continuous strip)*
PHP2,370.90
(exc. VAT)
PHP2,655.40
(inc. VAT)
FREE delivery for orders over ₱3,000.00
In Stock
- Plus 23,695 unit(s) shipping from August 24, 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per Unit |
|---|---|
| 50 + | PHP47.418 |
*price indicative
- RS Stock No.:
- 788-3082P
- Mfr. Part No.:
- CGA6P3X7S1H106K250AB
- Manufacturer:
- TDK
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TDK | |
| Capacitance | 10μF | |
| Product Type | Multilayer Ceramic Capacitor | |
| Voltage | 50V dc | |
| Package/Case | 1210 | |
| Packaging | Tape & Reel | |
| Mount Type | Surface | |
| Dielectric | X7S | |
| Tolerance | ±10 % | |
| Automotive Standard | AEC-Q200 | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Surface Mount | |
| Series | CGA | |
| Length | 3.2mm | |
| Height | 2.5mm | |
| Width | 2.5mm | |
| Standards/Approvals | RoHS | |
| Maximum Operating Temperature | 125°C | |
| Select all | ||
|---|---|---|
Brand TDK | ||
Capacitance 10μF | ||
Product Type Multilayer Ceramic Capacitor | ||
Voltage 50V dc | ||
Package/Case 1210 | ||
Packaging Tape & Reel | ||
Mount Type Surface | ||
Dielectric X7S | ||
Tolerance ±10 % | ||
Automotive Standard AEC-Q200 | ||
Minimum Operating Temperature -55°C | ||
Termination Type Surface Mount | ||
Series CGA | ||
Length 3.2mm | ||
Height 2.5mm | ||
Width 2.5mm | ||
Standards/Approvals RoHS | ||
Maximum Operating Temperature 125°C | ||
TDK CGA Automotive 1210 series, X6S, X7S and X7T
Professional range of TDK multilayer ceramic chip capacitors from the CGA series. Suitable applications would include automotive engine control units, sensor modules and power supply smoothing
Monolithic structure
Low ESL
Low self-heating and high ripple resistance
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