TDK 10 μF Multilayer Ceramic Capacitor, 100V dc, ±10 %, Surface
- RS Stock No.:
- 242-7523
- Mfr. Part No.:
- CGA9N3X7S2A106K230KE
- Manufacturer:
- TDK
This image is representative of the product range
Subtotal (1 reel of 500 units)*
PHP57,442.50
(exc. VAT)
PHP64,335.50
(inc. VAT)
FREE delivery for orders over ₱5,000.00
Temporarily out of stock
- Shipping from December 29, 2026
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Units | Per Unit | Per Reel* |
|---|---|---|
| 500 + | PHP114.885 | PHP57,442.50 |
*price indicative
- RS Stock No.:
- 242-7523
- Mfr. Part No.:
- CGA9N3X7S2A106K230KE
- Manufacturer:
- TDK
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TDK | |
| Product Type | Multilayer Ceramic Capacitor | |
| Capacitance | 10μF | |
| Voltage | 100V dc | |
| Package/Case | 2220 | |
| Construction | Stacked | |
| Mount Type | Surface | |
| Packaging | Tape & Reel | |
| Dielectric | X7S | |
| Tolerance | ±10 % | |
| Automotive Standard | AEC-Q200 | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Solder | |
| Series | CGA | |
| Width | 5mm | |
| Height | 2.3mm | |
| Length | 5.7mm | |
| Standards/Approvals | REACH, RoHS | |
| Maximum Operating Temperature | 125°C | |
| Select all | ||
|---|---|---|
Brand TDK | ||
Product Type Multilayer Ceramic Capacitor | ||
Capacitance 10μF | ||
Voltage 100V dc | ||
Package/Case 2220 | ||
Construction Stacked | ||
Mount Type Surface | ||
Packaging Tape & Reel | ||
Dielectric X7S | ||
Tolerance ±10 % | ||
Automotive Standard AEC-Q200 | ||
Minimum Operating Temperature -55°C | ||
Termination Type Solder | ||
Series CGA | ||
Width 5mm | ||
Height 2.3mm | ||
Length 5.7mm | ||
Standards/Approvals REACH, RoHS | ||
Maximum Operating Temperature 125°C | ||
The TDK soft termination CGA series, automotive grade of TDK's multilayer ceramic chip capacitor, is a product incorporating a conductive resin layer into the terminal electrodes. The resin layer protects the ceramic body from cracks by relieving stress caused by thermal shock and board flexure. It is used in applications such as fail safe design for battery line, prevention of ceramic element crack by board bending, prevention of solder crack by thermal shock, equipment such as mobile devices and smart key having a high possibility of drop.
High resistance to mechanical stress and thermal shock by resin layers
X8R and X8L type whose maximum temperature are up to 150 degree Celsius are available
C0G type having excellent stable temperature and DC-bias characteristics is also available
AEC-Q20
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