Syfer Technology 3.3 nF Multilayer Ceramic Capacitor, 100V dc, ±10 %
- RS Stock No.:
- 170-6576
- Mfr. Part No.:
- 0603Y1000332KXT
- Manufacturer:
- Syfer Technology
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- RS Stock No.:
- 170-6576
- Mfr. Part No.:
- 0603Y1000332KXT
- Manufacturer:
- Syfer Technology
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Syfer Technology | |
| Product Type | Multilayer Ceramic Capacitor | |
| Capacitance | 3.3nF | |
| Voltage | 100V dc | |
| Construction | Stacked | |
| Package/Case | 0603 | |
| Dielectric | X7R | |
| Tolerance | ±10 % | |
| Automotive Standard | AEC-Q200 | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Surface Mount | |
| Series | Flexicap | |
| Standards/Approvals | RoHS, IECQ-CECC, ISO 14001, OHSAS 18001 | |
| Width | 0.8mm | |
| Length | 1.6mm | |
| Height | 0.8mm | |
| Maximum Operating Temperature | 125°C | |
| Select all | ||
|---|---|---|
Brand Syfer Technology | ||
Product Type Multilayer Ceramic Capacitor | ||
Capacitance 3.3nF | ||
Voltage 100V dc | ||
Construction Stacked | ||
Package/Case 0603 | ||
Dielectric X7R | ||
Tolerance ±10 % | ||
Automotive Standard AEC-Q200 | ||
Minimum Operating Temperature -55°C | ||
Termination Type Surface Mount | ||
Series Flexicap | ||
Standards/Approvals RoHS, IECQ-CECC, ISO 14001, OHSAS 18001 | ||
Width 0.8mm | ||
Length 1.6mm | ||
Height 0.8mm | ||
Maximum Operating Temperature 125°C | ||
- COO (Country of Origin):
- GB
Syfer Flexicap 0603
FlexiCap™ has been developed as a result of listening to customers’ experiences of stress damage to MLCCs
A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish
FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors
An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking
FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes