Infineon, Type N-Channel 3 Phase Smart Power Module, 20 A 3.21 V, 18-Pin DIP, Through Hole
- RS Stock No.:
- 233-3499
- Mfr. Part No.:
- IM818LCCXKMA1
- Manufacturer:
- Infineon
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- RS Stock No.:
- 233-3499
- Mfr. Part No.:
- IM818LCCXKMA1
- Manufacturer:
- Infineon
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Product Type | Smart Power Module | |
| Maximum Continuous Collector Current Ic | 20A | |
| Maximum Collector Emitter Voltage Vceo | 3.21V | |
| Maximum Power Dissipation Pd | 156W | |
| Number of Transistors | 6 | |
| Configuration | 3 Phase | |
| Package Type | DIP | |
| Mount Type | Through Hole | |
| Channel Type | Type N | |
| Pin Count | 18 | |
| Maximum Collector Emitter Saturation Voltage VceSAT | 3.21V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 125°C | |
| Height | 5.1mm | |
| Standards/Approvals | No | |
| Length | 36mm | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Product Type Smart Power Module | ||
Maximum Continuous Collector Current Ic 20A | ||
Maximum Collector Emitter Voltage Vceo 3.21V | ||
Maximum Power Dissipation Pd 156W | ||
Number of Transistors 6 | ||
Configuration 3 Phase | ||
Package Type DIP | ||
Mount Type Through Hole | ||
Channel Type Type N | ||
Pin Count 18 | ||
Maximum Collector Emitter Saturation Voltage VceSAT 3.21V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 125°C | ||
Height 5.1mm | ||
Standards/Approvals No | ||
Length 36mm | ||
Automotive Standard No | ||
The Infineon three-phase IGBT based intelligent power module with open emitter in DIP 36x23D package providing fully-featured compact inverter solution with excellent thermal conduction for motor drive applications including industrial drives, fans and pumps, HVAC outdoor fan, active filters, and etc.
Excellent thermal performance with DCB substrate
Suitable for space constrained industrial applications through ultra compact footprint
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