TE Connectivity 0.93 mm Pitch 4677 Way LGA Surface Prototyping IC Socket
- RS Stock No.:
- 267-4873
- Mfr. Part No.:
- 2-2347090-1
- Manufacturer:
- TE Connectivity
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RS will no longer stock this product.
- RS Stock No.:
- 267-4873
- Mfr. Part No.:
- 2-2347090-1
- Manufacturer:
- TE Connectivity
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TE Connectivity | |
| Product Type | IC Socket | |
| Package Type | LGA | |
| IC Socket Type | Prototyping Socket | |
| Current | 500mA | |
| Number of Contacts | 4677 | |
| Pitch | 0.93mm | |
| Orientation | Straight | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Minimum Operating Temperature | -40°C | |
| Socket Mount Type | Surface | |
| Device Mount Type | Surface | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | RoHS, UL 94V-0 | |
| Housing Material | Liquid Crystal Polymer | |
| Select all | ||
|---|---|---|
Brand TE Connectivity | ||
Product Type IC Socket | ||
Package Type LGA | ||
IC Socket Type Prototyping Socket | ||
Current 500mA | ||
Number of Contacts 4677 | ||
Pitch 0.93mm | ||
Orientation Straight | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Minimum Operating Temperature -40°C | ||
Socket Mount Type Surface | ||
Device Mount Type Surface | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals RoHS, UL 94V-0 | ||
Housing Material Liquid Crystal Polymer | ||
- COO (Country of Origin):
- CN
The TE Connectivity new LGA 4677 sockets for top processor players are designed with high bandwidth demands with PCI express and DDR5 8 channel support available as well as providing a much larger amount of memory channels. When partnered with TE Connectivity DDR5 DIMM socket solutions and PCI express generation 5. The TE LGA 4677 socket provides a total solution for supporting the data rates required by next generation system architectures.
Increased performance
Supports auto assembly processes
Reduced overall power consumption
Greater number of memory channels
Supports higher speed networking protocols
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