Winslow Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter, QFP to PGA
- RS Stock No.:
- 285-4641
- Mfr. Part No.:
- WA10050DQAETRC
- Manufacturer:
- Winslow
This image is representative of the product range
Bulk discount available
Subtotal (1 unit)*
PHP3,181.36
(exc. VAT)
PHP3,563.12
(inc. VAT)
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Units | Per Unit |
|---|---|
| 1 - 24 | PHP3,181.36 |
| 25 - 99 | PHP3,085.92 |
| 100 + | PHP2,993.35 |
*price indicative
- RS Stock No.:
- 285-4641
- Mfr. Part No.:
- WA10050DQAETRC
- Manufacturer:
- Winslow
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Winslow | |
| Product Type | IC Socket Adapter | |
| Connection A | QFP | |
| Connection Gender A | Female | |
| Number of Contacts A | 100 | |
| Number of Contacts B | 100 | |
| Connection Gender B | Male | |
| Pitch | 2.54mm | |
| Connection B | PGA | |
| Contact Plating | Tin over Nickel | |
| Mount Type | Through Hole | |
| Orientation | Straight | |
| Contact Material | Brass | |
| Standards/Approvals | No | |
| Housing Material | FR4 | |
| Select all | ||
|---|---|---|
Brand Winslow | ||
Product Type IC Socket Adapter | ||
Connection A QFP | ||
Connection Gender A Female | ||
Number of Contacts A 100 | ||
Number of Contacts B 100 | ||
Connection Gender B Male | ||
Pitch 2.54mm | ||
Connection B PGA | ||
Contact Plating Tin over Nickel | ||
Mount Type Through Hole | ||
Orientation Straight | ||
Contact Material Brass | ||
Standards/Approvals No | ||
Housing Material FR4 | ||
- COO (Country of Origin):
- GB
QFP to PGA One Piece Sockets
Standard 'Adaptics' stu suit a broad range of QFPs for both development and production requirements. A low cost solution which converts a QFP IC to the data sheet PGA footprint.
PCB: Epoxy Fibreglass FR4
Pins: Brass
Plating: Tin over Nickel
IC Sockets-Package Adaptics
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.