Fischer Elektronik Heatsink, Universal Square Alu 10 mm 40 mm 40 mm
- RS Stock No.:
- 674-4769
- Mfr. Part No.:
- ICK BGA 40x40x10
- Manufacturer:
- Fischer Elektronik
Currently unavailable
Sorry, we don't know when this will be back in stock.
- RS Stock No.:
- 674-4769
- Mfr. Part No.:
- ICK BGA 40x40x10
- Manufacturer:
- Fischer Elektronik
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Fischer Elektronik | |
| For Use With | Universal Square Alu | |
| Product Type | Heatsink | |
| Length | 40mm | |
| Width | 40 mm | |
| Height | 10mm | |
| Fastening | Clamp, Conductive Adhesive, Screw, Thermally conductive adhesive | |
| Colour | Black | |
| Finish | Black Anodised | |
| Compatible Package Type | PGA, IC, LED, SMD, PLCC, DIL/IC, BGA | |
| Standards/Approvals | No | |
| Application | Power PC, Cooler, PLCC, Semiconductor, Ic Processors, Fan, Thermal, Microprocessor, SMD, Pin Heat Sinks, PGA, Heat Sink For IC, Bga | |
| Material | Aluminium | |
| Special Features | Effective Heat Dissipation, Pulse Output and Alarm Device Circuit, High-grade Industrial Type, High Mechanical Stability, Flow-favourable Omnidirectional Fin Geometry, High Reliability, Low Current Consumption, Easy Mounting, Compact Design, Excellent Thermal Efficiency | |
| Select all | ||
|---|---|---|
Brand Fischer Elektronik | ||
For Use With Universal Square Alu | ||
Product Type Heatsink | ||
Length 40mm | ||
Width 40 mm | ||
Height 10mm | ||
Fastening Clamp, Conductive Adhesive, Screw, Thermally conductive adhesive | ||
Colour Black | ||
Finish Black Anodised | ||
Compatible Package Type PGA, IC, LED, SMD, PLCC, DIL/IC, BGA | ||
Standards/Approvals No | ||
Application Power PC, Cooler, PLCC, Semiconductor, Ic Processors, Fan, Thermal, Microprocessor, SMD, Pin Heat Sinks, PGA, Heat Sink For IC, Bga | ||
Material Aluminium | ||
Special Features Effective Heat Dissipation, Pulse Output and Alarm Device Circuit, High-grade Industrial Type, High Mechanical Stability, Flow-favourable Omnidirectional Fin Geometry, High Reliability, Low Current Consumption, Easy Mounting, Compact Design, Excellent Thermal Efficiency | ||
- COO (Country of Origin):
- DE
Fischer Elektronik ICK BGA Series Heatsink
ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).
Features and Benefits
Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).
BGA Heatsinks
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