Fischer Elektronik Heatsink, Ball Grid Array, 32K/W, 10 x 10 x 6mm, Self-Adhesive

Subtotal (1 pack of 50 units)*

PHP4,670.19

(exc. VAT)

PHP5,230.61

(inc. VAT)

Add to Basket
Select or type quantity
Temporarily out of stock
  • 3 unit(s) shipping from January 27, 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Pack(s)
Per Pack
Per Unit*
1 +PHP4,670.19PHP93.404

*price indicative

RS Stock No.:
577-631
Mfr. Part No.:
ICK BGA 10 X 10
Manufacturer:
Fischer Elektronik
Find similar products by selecting one or more attributes.
Select all

Brand

Fischer Elektronik

For Use With

Ball Grid Array

Length

10mm

Width

10mm

Height

6mm

Dimensions

10 x 10 x 6mm

Thermal Resistance

32K/W

Mounting

Self-Adhesive

RoHS Status: Exempt

COO (Country of Origin):
DE
The Fischer Elektronik Heatsinks for BGAs are specifically designed for Ball Grid Array (BGA) components, ensuring optimal heat dissipation. With dimensions of 10 x 10 x 6 mm, these heatsinks precisely match BGA types and can be directly glued onto the component using double-sided adhesive thermal conductive foil for secure and efficient thermal management.

Black anodised
Universal socket

Related links