Phoenix Contact Heatsink, UCS Universal Housings 25 mm 50 mm 67 mm

Bulk discount available

Subtotal (1 unit)*

PHP2,204.54

(exc. VAT)

PHP2,469.08

(inc. VAT)

Add to Basket
Select or type quantity
Temporarily out of stock
  • Shipping from March 30, 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units
Per Unit
1 - 9PHP2,204.54
10 +PHP2,028.06

*price indicative

RS Stock No.:
496-140
Mfr. Part No.:
1481703
Manufacturer:
Phoenix Contact
Find similar products by selecting one or more attributes.
Select all

Brand

Phoenix Contact

For Use With

UCS Universal Housings

Product Type

Heatsink

Length

50mm

Width

67 mm

Height

25mm

Fastening

Screw

Series

UCS

Finish

Anodised

Standards/Approvals

VDMA 24364:2018-05, IEC 60068-2-6:2007-12, EU RoHS, IEC 60068-2-27:2008-02

Application

Thermal

Material

Aluminium

Special Features

Additional machining is required to attach the heat expansion element to the heatsink

COO (Country of Origin):
CN
The Phoenix Contact Heat Expansion Element is expertly designed for demanding thermal applications. Engineered from high-quality anodized aluminum, this component ensures optimal heat dissipation while meeting the needs of various housing sizes. The product seamlessly integrates as part of the UCS housing series, providing a reliable solution for enhancing the thermal management of devices. With a width of 67 mm, depth of 25 mm, and length of 50 mm, it is compact yet effective. This heat expansion element is adept at addressing specific hot spots, enabling tailored thermal solutions for a diverse range of applications. Its design ensures that users benefit from a dependable path for heat dissipation, streamlining assembly with standard mounting screws included. Whether you are enhancing existing systems or developing new applications, this product guarantees unmatched performance and reliability.

Custom tailored for various applications requiring thermal efficiency

Easy integration with standard mounting solutions for hassle free installation

Designed for optimal heat management in devices exposed to thermal stress

Support for individual milling to meet specific application needs

Provides a robust solution for environments with temperature fluctuations

Related links