ECS Inc International 80000 MHz Crystal Oscillator ±50 ppm Ceramic package 4-Pin 0.45 mm 2 mm 1.6 mm

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PHP55.86

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PHP62.56

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1 - 9PHP55.86
10 - 99PHP50.62
100 - 499PHP46.26
500 - 999PHP42.77
1000 +PHP34.91

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Packaging Options:
RS Stock No.:
301-157
Mfr. Part No.:
ECS-320-8-37CKM
Manufacturer:
ECS Inc International
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Brand

ECS Inc International

Standard Frequency

80000MHz

Product Type

Crystal Oscillator

Mount Type

Surface Mount

Load Capacitance

8pF

Package Type

Ceramic package

Pin Count

4

Length

2mm

Width

1.6 mm

Height

0.45mm

Frequency Tolerance

±50 ppm

Frequency Stability

±50 ppm

Minimum Operating Temperature

-20°C

Series Resistance

100Ω

Maximum Operating Temperature

70°C

Standards/Approvals

RoHS Compliant

Series

ECX-1637

Automotive Standard

No

The ECS Inc International Advanced surface mount crystal oscillator designed to meet the demands of modern electronic applications. With its Compact 2.0mm x 1.6mm ceramic package, this oscillator is optimised for high-density environments such as IoT devices, medical equipment, and consumer electronics. Operating within a frequency range of 32 MHz, it guarantees exceptional performance with precise frequency stability and tolerance specifications. The robust construction ensures reliability, making it Ideal for applications where space is limited but performance cannot be compromised. Additionally, it adheres to RoHS compliance, ensuring eco-friendliness throughout its operational lifecycle. The versatile application of this oscillator positions it as an essential component for engineers and developers seeking dependable timing solutions.

Compact design Ideal for space-constrained applications

Enhanced frequency stability reduces the risk of drift over time

Wide operating temperature range ensures performance in diverse environments

RoHS compliant, contributing to greener technology solutions

Low profile optimises board layout efficiency

Versatile applications across telecommunications and consumer electronics

Facilitates easier integration into high-density circuit boards

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