50 Ω STMicroelectronics PCB Chip Balun
- RS Stock No.:
- 261-5027P
- Mfr. Part No.:
- BALFHB-WL-01D3
- Manufacturer:
- STMicroelectronics
This image is representative of the product range
Bulk discount available
Subtotal 10 units (supplied on a continuous strip)*
PHP303.98
(exc. VAT)
PHP340.46
(inc. VAT)
FREE delivery for orders over ₱3,000.00
In Stock
- 300 unit(s) ready to ship from another location
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per Unit |
|---|---|
| 10 - 95 | PHP30.398 |
| 100 - 245 | PHP27.36 |
| 250 - 495 | PHP24.604 |
| 500 + | PHP22.132 |
*price indicative
- RS Stock No.:
- 261-5027P
- Mfr. Part No.:
- BALFHB-WL-01D3
- Manufacturer:
- STMicroelectronics
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | STMicroelectronics | |
| Product Type | Chip Balun | |
| Balance Impedance | 50Ω | |
| Maximum Insertion Loss | 1.45dB | |
| Mount Type | PCB | |
| Pin Count | 8 | |
| Maximum Frequency | 928MHz | |
| Minimum Frequency | 862MHz | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Height | 680μm | |
| Length | 2150μm | |
| Standards/Approvals | RoHS | |
| Series | BALFHB | |
| Width | 1880 μm | |
| Select all | ||
|---|---|---|
Brand STMicroelectronics | ||
Product Type Chip Balun | ||
Balance Impedance 50Ω | ||
Maximum Insertion Loss 1.45dB | ||
Mount Type PCB | ||
Pin Count 8 | ||
Maximum Frequency 928MHz | ||
Minimum Frequency 862MHz | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Height 680μm | ||
Length 2150μm | ||
Standards/Approvals RoHS | ||
Series BALFHB | ||
Width 1880 μm | ||
- COO (Country of Origin):
- CN
The STMicroelectronics chip balun is an ultra-miniature balun. This device integrates a matching network, balun, and harmonics filter. Matching impedance has been customized for the STM32WL sub-GHz wireless microcontrollers. It is using STMicroelectronics IPD technology on a nonconductive glass substrate, which optimizes RF performances.
Small footprint
High RF performance
RF BOM and area reduction
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