100 Ω STMicroelectronics Surface Mount Chip Balun
- RS Stock No.:
- 192-4968
- Mfr. Part No.:
- BAL-UWB-01E3
- Manufacturer:
- STMicroelectronics
This image is representative of the product range
Bulk discount available
Subtotal (1 pack of 25 units)*
PHP593.75
(exc. VAT)
PHP665.00
(inc. VAT)
FREE delivery for orders over ₱3,000.00
Temporarily out of stock
- Shipping from June 15, 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per Unit | Per Pack* |
|---|---|---|
| 25 - 25 | PHP23.75 | PHP593.75 |
| 50 - 475 | PHP23.037 | PHP575.93 |
| 500 - 975 | PHP22.346 | PHP558.65 |
| 1000 - 2475 | PHP21.676 | PHP541.90 |
| 2500 + | PHP21.025 | PHP525.63 |
*price indicative
- RS Stock No.:
- 192-4968
- Mfr. Part No.:
- BAL-UWB-01E3
- Manufacturer:
- STMicroelectronics
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | STMicroelectronics | |
| Product Type | Chip Balun | |
| Balance Impedance | 100Ω | |
| Maximum Insertion Loss | 1.2dB | |
| Mount Type | Surface Mount | |
| Pin Count | 6 | |
| Maximum Frequency | 8GHz | |
| Minimum Operating Temperature | -40°C | |
| Minimum Frequency | 3GHz | |
| Package Type | Bumpless CSP | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | No | |
| Length | 1.825mm | |
| Select all | ||
|---|---|---|
Brand STMicroelectronics | ||
Product Type Chip Balun | ||
Balance Impedance 100Ω | ||
Maximum Insertion Loss 1.2dB | ||
Mount Type Surface Mount | ||
Pin Count 6 | ||
Maximum Frequency 8GHz | ||
Minimum Operating Temperature -40°C | ||
Minimum Frequency 3GHz | ||
Package Type Bumpless CSP | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals No | ||
Length 1.825mm | ||
- COO (Country of Origin):
- CN
The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 Ghz. This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.
Very low profile
High RF performance
PCB space saving
Efficient manufacturability
LGA footprint compatible
Low thickness ≤ 450 μm
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