Rubycon 2200 μF Capacitor 35V dc, Radial, Through Hole
- RS Stock No.:
- 172-7643
- Mfr. Part No.:
- 35YXF2200M16X31.5
- Manufacturer:
- Rubycon
This image is representative of the product range
Subtotal (200 units, in boxes of 200)*
PHP13,419.80
(exc. VAT)
PHP15,030.20
(inc. VAT)
FREE delivery for orders over ₱5,000.00
Last RS stock
- Final 200 unit(s), ready to ship from another location
Units | Per Unit | Per Box* |
|---|---|---|
| 200 + | PHP67.099 | PHP13,419.80 |
*price indicative
- RS Stock No.:
- 172-7643
- Mfr. Part No.:
- 35YXF2200M16X31.5
- Manufacturer:
- Rubycon
Specifications
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Rubycon | |
| Capacitance | 2200μF | |
| Product Type | Capacitor | |
| Voltage | 35V dc | |
| Mount Type | Radial, Through Hole | |
| Construction | Radial Can | |
| Polarity | Polar | |
| Height | 31.5mm | |
| Length | 31.5mm | |
| Minimum Operating Temperature | -40°C | |
| Diameter | 16mm | |
| Capacitor Ripple Current | 2A | |
| Pin Count | 2 | |
| Maximum Operating Temperature | 105°C | |
| Lead Pitch | 7.5mm | |
| Standards/Approvals | RoHS | |
| Lifetime | 10000 h | |
| Automotive Standard | No | |
| Series | YXF | |
| Leakage Current | 3μA | |
| Tolerance | ±20 % | |
| Dissipation Factor | 12% | |
| Select all | ||
|---|---|---|
Brand Rubycon | ||
Capacitance 2200μF | ||
Product Type Capacitor | ||
Voltage 35V dc | ||
Mount Type Radial, Through Hole | ||
Construction Radial Can | ||
Polarity Polar | ||
Height 31.5mm | ||
Length 31.5mm | ||
Minimum Operating Temperature -40°C | ||
Diameter 16mm | ||
Capacitor Ripple Current 2A | ||
Pin Count 2 | ||
Maximum Operating Temperature 105°C | ||
Lead Pitch 7.5mm | ||
Standards/Approvals RoHS | ||
Lifetime 10000 h | ||
Automotive Standard No | ||
Series YXF | ||
Leakage Current 3μA | ||
Tolerance ±20 % | ||
Dissipation Factor 12% | ||
YXF Series
Miniature high temperature radial wire ended electrolytic capacitors for use in applications where board space is at a premium.
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