onsemi, MICROFJ-30020-TSV-TR1 Si Photodiode, Surface Mount SMT
- RS Stock No.:
- 185-9622
- Mfr. Part No.:
- MICROFJ-30020-TSV-TR1
- Manufacturer:
- onsemi
Temporarily out of stock - back order for despatch 21/01/2025, delivery within 10 working days from desptach date
Price Each
PHP3,222.00
(exc. VAT)
PHP3,608.64
(inc. VAT)
Units | Per Unit |
|---|---|
| 1 - 4 | PHP3,222.00 |
| 5 - 9 | PHP3,125.35 |
| 10 - 24 | PHP3,032.03 |
| 25 - 49 | PHP2,964.25 |
| 50 + | PHP2,899.80 |
- RS Stock No.:
- 185-9622
- Mfr. Part No.:
- MICROFJ-30020-TSV-TR1
- Manufacturer:
- onsemi
Technical data sheets
Legislation and Compliance
- COO (Country of Origin):
- IE
Product Details
High-density microcells
J-Series sensors feature ON Semiconductor's unique 'fast output' terminal
Temperature stability of 21.5 mV/°C
Exceptional breakdown voltage uniformity of ±250 mV
Available in a reflow solder compatible TSV chip-scale package
Ultra-low dark count rates of 50 kHz/mm2 typical
Optimized for high-performance timing applications, such as ToF-PET
3 mm, 4 mm and 6 mm sensor sizes
Bias voltage of <30 V
Results in a 50% photon detection efficiency (PDE) at 420 nm
Improved signal rise time and the microcell recovery time
Negates the need for active voltage control
Industry-leading uniformity
TSV package results in almost zero deadspace allowing the creation of high fill factor arrays and is ferrous-metal free
Applications
Medical Imaging
Hazard & Threat
3D Ranging & Sensing
Biophotonics & Sciences
High Energy Physics
J-Series sensors feature ON Semiconductor's unique 'fast output' terminal
Temperature stability of 21.5 mV/°C
Exceptional breakdown voltage uniformity of ±250 mV
Available in a reflow solder compatible TSV chip-scale package
Ultra-low dark count rates of 50 kHz/mm2 typical
Optimized for high-performance timing applications, such as ToF-PET
3 mm, 4 mm and 6 mm sensor sizes
Bias voltage of <30 V
Results in a 50% photon detection efficiency (PDE) at 420 nm
Improved signal rise time and the microcell recovery time
Negates the need for active voltage control
Industry-leading uniformity
TSV package results in almost zero deadspace allowing the creation of high fill factor arrays and is ferrous-metal free
Applications
Medical Imaging
Hazard & Threat
3D Ranging & Sensing
Biophotonics & Sciences
High Energy Physics
For products that are Customized and under Non-cancellable & Non-returnable, Sales & Conditions apply.
Specifications
Attribute | Value |
|---|---|
| Package Type | SMT |
| Mounting Type | Surface Mount |
| Amplifier Function | No |
| Number of Pins | 4 |
| Diode Material | Si |
| Minimum Wavelength Detected | 200nm |
| Maximum Wavelength Detected | 900nm |
| Length | 3.16mm |
| Width | 3.16mm |
| Height | 0.46mm |
| Series | J |
| Breakdown Voltage | 24.7V |