Specifications

Technical data sheets

Legislation and Compliance

Product Details

Find similar products by selecting one or more attributes.

Select all	Attribute	Value
	Brand	Samtec
	Product Type	PCB Socket
	Number of Contacts	160
	Number of Rows	2
	Sub Type	Terminal Assembly
	Pitch	0.5mm
	Current	2.7A
	Termination Type	Solder
	Mount Type	Surface
	Orientation	Straight
	Connector System	Board-to-Board
	Stacking Height	10mm
	Voltage	339 V
	Series	ASP
	Row Pitch	6.18mm
	Minimum Operating Temperature	-55°C
	Contact Material	Bronze
	Maximum Operating Temperature	125°C
	Contact Plating	Gold over Nickel
	Contact Gender	Female
	Standards/Approvals	RoHS

	Select all
	Brand Samtec
	Product Type PCB Socket
	Number of Contacts 160
	Number of Rows 2
	Sub Type Terminal Assembly
	Pitch 0.5mm
	Current 2.7A
	Termination Type Solder
	Mount Type Surface
	Orientation Straight
	Connector System Board-to-Board
	Stacking Height 10mm
	Voltage 339 V
	Series ASP
	Row Pitch 6.18mm
	Minimum Operating Temperature -55°C
	Contact Material Bronze
	Maximum Operating Temperature 125°C
	Contact Plating Gold over Nickel
	Contact Gender Female
	Standards/Approvals RoHS

Datasheet

COO (Country of Origin):: CR

Altera® HSMC defines electrical and mechanical properties of a high speed mezzanine card interface. This specification standardizes the way in which mezzanine cards communicate and connect to host boards. By taking advantage of the high-performance I/O features found in today’s FPGA devices, manufacturers can build a single mezzanine card that will then interface to multiple host boards. Similarly, they can build a host board that can leverage many different, pre-built, mezzanine cards.

Samtec ASP Series Straight Surface PCB Socket, 160-Contact, 2 Row, 0.5 mm Pitch Solder

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