Infineon HEXFET Type N-Channel Power MOSFET, 75 A, 75 V Enhancement, 3-Pin TO-263 IRF2807ZSTRLPBF
- RS Stock No.:
- 831-2806
- Mfr. Part No.:
- IRF2807ZSTRLPBF
- Manufacturer:
- Infineon
This image is representative of the product range
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Subtotal (1 pack of 10 units)*
PHP1,112.50
(exc. VAT)
PHP1,246.00
(inc. VAT)
FREE delivery for orders over ₱3,000.00
Last RS stock
- Final 30 unit(s), ready to ship from another location
Units | Per Unit | Per Pack* |
|---|---|---|
| 10 - 10 | PHP111.25 | PHP1,112.50 |
| 20 - 40 | PHP107.913 | PHP1,079.13 |
| 50 - 90 | PHP104.676 | PHP1,046.76 |
| 100 - 190 | PHP101.534 | PHP1,015.34 |
| 200 + | PHP98.488 | PHP984.88 |
*price indicative
- RS Stock No.:
- 831-2806
- Mfr. Part No.:
- IRF2807ZSTRLPBF
- Manufacturer:
- Infineon
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Product Type | Power MOSFET | |
| Channel Type | Type N | |
| Maximum Continuous Drain Current Id | 75A | |
| Maximum Drain Source Voltage Vds | 75V | |
| Series | HEXFET | |
| Package Type | TO-263 | |
| Mount Type | Surface | |
| Pin Count | 3 | |
| Maximum Drain Source Resistance Rds | 9.4mΩ | |
| Channel Mode | Enhancement | |
| Typical Gate Charge Qg @ Vgs | 71nC | |
| Forward Voltage Vf | 1.3V | |
| Maximum Power Dissipation Pd | 300W | |
| Minimum Operating Temperature | -55°C | |
| Maximum Gate Source Voltage Vgs | ±20 V | |
| Maximum Operating Temperature | 175°C | |
| Length | 10.67mm | |
| Standards/Approvals | No | |
| Height | 4.83mm | |
| Width | 9.65 mm | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Product Type Power MOSFET | ||
Channel Type Type N | ||
Maximum Continuous Drain Current Id 75A | ||
Maximum Drain Source Voltage Vds 75V | ||
Series HEXFET | ||
Package Type TO-263 | ||
Mount Type Surface | ||
Pin Count 3 | ||
Maximum Drain Source Resistance Rds 9.4mΩ | ||
Channel Mode Enhancement | ||
Typical Gate Charge Qg @ Vgs 71nC | ||
Forward Voltage Vf 1.3V | ||
Maximum Power Dissipation Pd 300W | ||
Minimum Operating Temperature -55°C | ||
Maximum Gate Source Voltage Vgs ±20 V | ||
Maximum Operating Temperature 175°C | ||
Length 10.67mm | ||
Standards/Approvals No | ||
Height 4.83mm | ||
Width 9.65 mm | ||
Automotive Standard No | ||
Infineon HEXFET Series MOSFET, 89A Maximum Continuous Drain Current, 170W Maximum Power Dissipation - IRF2807ZSTRLPBF
This MOSFET is designed for high-performance switching applications, offering efficiency and reliability across various electronic circuits. Its low on-resistance and strong thermal characteristics make it essential for users in automation, electrical, and mechanical sectors, enabling effective power management and reduced energy loss.
Features & Benefits
• Continuous drain current up to 89A
• Maximum drain-source voltage of 75V
• Operating temperature up to +175°C for thermal stability
• Low Rds(on) of 9.4 mΩ to reduce power loss
• Quick switching abilities enhance system responsiveness
• Enhancement mode device for optimal operation
Applications
• Used in power supply circuits for efficient energy conversion
• Employed in automotive and industrial systems for motor control
• Suitable for DC-DC converters and switching regulators
• Applicable in high-frequency switching in electronics
• Utilised for overload protection in various electrical systems
What is the maximum gate-source voltage this component can handle?
It can manage a maximum gate-source voltage of ±20V, ensuring compatibility with diverse control signals.
How does this component perform under high temperatures?
With a maximum operating temperature of +175°C, it remains stable and functional in high-temperature environments, making it suitable for such applications.
What is the purpose of the low on-resistance feature?
The low on-resistance minimises heat generation and enhances efficiency during operation, which is important for high current applications.
Can it be used in both surface mount and through-hole designs?
This device is specifically designed for surface mount technology in a D2PAK package, optimising space and thermal performance.
How does the switching speed benefit system design?
Fast switching improves overall system efficiency and allows for Compact design by facilitating higher frequency operation in power management solutions.
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