Infineon HEXFET Type P-Channel MOSFET, 760 mA, 30 V Enhancement, 3-Pin SOT-23 IRLML5103TRPBF
- RS Stock No.:
- 302-038
- Distrelec Article No.:
- 304-36-996
- Mfr. Part No.:
- IRLML5103TRPBF
- Manufacturer:
- Infineon
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PHP96.43
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PHP108.00
(inc. VAT)
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Units | Per Unit | Per Pack* |
|---|---|---|
| 5 - 20 | PHP19.286 | PHP96.43 |
| 25 - 95 | PHP18.708 | PHP93.54 |
| 100 - 245 | PHP18.146 | PHP90.73 |
| 250 - 495 | PHP17.604 | PHP88.02 |
| 500 + | PHP17.076 | PHP85.38 |
*price indicative
- RS Stock No.:
- 302-038
- Distrelec Article No.:
- 304-36-996
- Mfr. Part No.:
- IRLML5103TRPBF
- Manufacturer:
- Infineon
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Channel Type | Type P | |
| Product Type | MOSFET | |
| Maximum Continuous Drain Current Id | 760mA | |
| Maximum Drain Source Voltage Vds | 30V | |
| Package Type | SOT-23 | |
| Series | HEXFET | |
| Mount Type | Surface | |
| Pin Count | 3 | |
| Maximum Drain Source Resistance Rds | 600mΩ | |
| Channel Mode | Enhancement | |
| Minimum Operating Temperature | -55°C | |
| Typical Gate Charge Qg @ Vgs | 3.4nC | |
| Maximum Gate Source Voltage Vgs | 20V | |
| Forward Voltage Vf | -1.2V | |
| Maximum Power Dissipation Pd | 540mW | |
| Maximum Operating Temperature | 150°C | |
| Width | 1.4mm | |
| Standards/Approvals | No | |
| Length | 3.04mm | |
| Height | 1.02mm | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Channel Type Type P | ||
Product Type MOSFET | ||
Maximum Continuous Drain Current Id 760mA | ||
Maximum Drain Source Voltage Vds 30V | ||
Package Type SOT-23 | ||
Series HEXFET | ||
Mount Type Surface | ||
Pin Count 3 | ||
Maximum Drain Source Resistance Rds 600mΩ | ||
Channel Mode Enhancement | ||
Minimum Operating Temperature -55°C | ||
Typical Gate Charge Qg @ Vgs 3.4nC | ||
Maximum Gate Source Voltage Vgs 20V | ||
Forward Voltage Vf -1.2V | ||
Maximum Power Dissipation Pd 540mW | ||
Maximum Operating Temperature 150°C | ||
Width 1.4mm | ||
Standards/Approvals No | ||
Length 3.04mm | ||
Height 1.02mm | ||
Automotive Standard No | ||
Infineon HEXFET Series MOSFET, 760mA Maximum Continuous Drain Current, 540 mW Maximum Power Dissipation - IRLML5103TRPBF
This MOSFET is a versatile electronic component suited for efficient power switching applications. It is designed for use in automation, electronics, and mechanical industries, offering a compact solution for high-performance tasks. Its enhancement channel mode improves operational efficiency, making it a popular choice in applications that require dependable MOSFET functionality.
Features & Benefits
• Compact SOT-23 package appropriate for space-constrained designs
• High continuous drain current of 760 mA for enhanced durability
• Maximum drain-source voltage of 30 V for a range of applications
• Low Rds(on) of 600mΩ minimises power loss and boosts efficiency
• Typical gate charge of 3.4nC lowers switching losses
Applications
• Utilised in power management and conversion solutions
• Suitable for industrial automation setups
• Ideal for switch-mode power supply designs
• Supports battery management systems in electronic devices
• Employed in motor control that require efficient power switching
How does the MOSFET perform in high-temperature environments?
It functions effectively at temperatures up to +150°C, ensuring consistent performance under challenging conditions.
What is the significance of the low Rds(on) value?
A low Rds(on) of 600mΩ reduces energy loss during operation, enhancing overall system efficiency.
Can this MOSFET be used in compact designs?
Yes, the SOT-23 package enables integration into compact applications without compromising performance.
What is the maximum gate-source voltage this device can handle?
It can tolerate a maximum gate-source voltage of ±20V, ensuring safe operation within specified limits.
How should the installation be approached for optimal performance?
Proper handling and layout on the PCB are crucial to ensure adequate thermal management and connectivity for optimal results.
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