Brand-Rex MIKROE-308 24 Way Extender Board Adapter Adapter Board
- RS Stock No.:
- 101-363
- Mfr. Part No.:
- MIKROE-308
- Manufacturer:
- Brand-Rex
Bulk discount available
Subtotal (1 unit)*
PHP441.66
(exc. VAT)
PHP494.66
(inc. VAT)
FREE delivery for orders over ₱3,000.00
In Stock
- Plus 4 unit(s) shipping from March 09, 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per Unit |
|---|---|
| 1 - 9 | PHP441.66 |
| 10 - 99 | PHP397.49 |
| 100 + | PHP366.20 |
*price indicative
- RS Stock No.:
- 101-363
- Mfr. Part No.:
- MIKROE-308
- Manufacturer:
- Brand-Rex
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Brand-Rex | |
| Product Type | Extender Board Adapter | |
| Number of Contacts | 24 | |
| Sub Type | Adapter Board | |
| Standards/Approvals | OHSAS 18001:2008, ISO 14001:2015, ISO 9001:2015, ISO 27001:2013, RoHS Compliant | |
| Select all | ||
|---|---|---|
Brand Brand-Rex | ||
Product Type Extender Board Adapter | ||
Number of Contacts 24 | ||
Sub Type Adapter Board | ||
Standards/Approvals OHSAS 18001:2008, ISO 14001:2015, ISO 9001:2015, ISO 27001:2013, RoHS Compliant | ||
- COO (Country of Origin):
- RS
The MIKROE adapter is expertly designed to facilitate the conversion of TSSOP-SSOP 24 pins into a standard DIP 24 pins configuration, making it an ideal solution for prototyping and PCB applications. It accommodates the 300 mil width package and enables seamless integration into various electronic projects. With its compact design, this adapter ensures a reliable and efficient connection, perfect for engineers and makers alike who seek to leverage TSSOP package technology while maintaining compatibility with traditional DIP setups. The high-quality construction promises durability and performance, thereby enhancing the overall reliability of your electronic designs.
Simple conversion between TSSOP-SSOP and DIP
Versatile format support for different packages
Easy adaptation to various IC formats
Efficient transition between DIP and SSOP
Flexible design accommodates multiple package types
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