Electrolube Adhesive Syringe Gun 75ml
- RS Stock No.:
- 725-9984
- Mfr. Part No.:
- TCRGUNB
- Manufacturer:
- Electrolube
Bulk discount available
Subtotal (1 unit)*
PHP1,103.43
(exc. VAT)
PHP1,235.84
(inc. VAT)
FREE delivery for orders over ₱3,000.00
Temporarily out of stock
- 2 unit(s) shipping from December 17, 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per Unit |
|---|---|
| 1 - 4 | PHP1,103.43 |
| 5 - 9 | PHP1,070.33 |
| 10 + | PHP1,038.23 |
*price indicative
- RS Stock No.:
- 725-9984
- Mfr. Part No.:
- TCRGUNB
- Manufacturer:
- Electrolube
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Electrolube | |
| Type | Adhesive Gun | |
| Product Capacity | 75ml | |
| Select all | ||
|---|---|---|
Brand Electrolube | ||
Type Adhesive Gun | ||
Product Capacity 75ml | ||
- COO (Country of Origin):
- GB
Standards
RoHS Compliant (2002/95/EC)
Electrolube Dispensing Gun
Application
Thermal adhesives are a type of thermally conductive adhesive used to secure heat sinks and electronic components. Thermal adhesives are available in a number of mediums such as thermal paste, glue, tape and more. They work by creating a strong bond for heatsinks or electrical parts commonly via a two-part epoxy resin with thermal conductivity capabilities, drawing heat away from a device. Thermal adhesives are used in a variety of industries and applications such as:
• Heat sink bonding
• Potting/encapsulating sensors
• BGA die heat spreader interface
• Chip scale packages
• Power semiconductors
• Heat sink bonding
• Potting/encapsulating sensors
• BGA die heat spreader interface
• Chip scale packages
• Power semiconductors
How To Apply
Before applying, ensure surfaces are clean and free from grease, dust and contaminants. Insert the adhesive tube into the Electrolube application gun, which dispenses the product, providing efficient and accurate dispensing. Apply a thin layer of the adhesive to the components required for bonding, before leaving the product to cure for the recommended time of 24 hours as 20°C.
Note: Curing rate is dependent upon ambient conditions of temperature and humidity.