- RS Stock No.:
- 110-2545
- Manufacturer:
- RS PRO
24 In Global stock for delivery NCR Plus within 10 working day(s), rest of PH within 14 working days
Added
Price Each
PHP4,648.53
(exc. VAT)
PHP5,206.35
(inc. VAT)
Units | Per Unit |
1 - 9 | PHP4,648.53 |
10 - 39 | PHP4,509.07 |
40 + | PHP3,710.96 |
- RS Stock No.:
- 110-2545
- Manufacturer:
- RS PRO
Technical data sheets
Legislation and Compliance
- COO (Country of Origin):
- GB
Product Details
Double-Sided, Non-Allocated Motherboards
Complete flexibility of positioning of Vdc or earthing.
Four voltage lines available.
Option to connect power supply using 6.3 mm terminal type faston or M3 thread.
Choice of various widths and pitches of connectors.
Row b can be used as a 0 V reserve line, in order to minimise crosstalk on rows a and c. Contacts 1, 2, 31 and 32 are allocated via a 2.54 mm pitch connection. Other contacts can be allocated by wiring or wrapping. Rows a, b and c can be connected together using strap connectors (designed to connect DIN connector pins).
Boards feature high-quality foil laminate holes with varnish to avoid solder bridges.
Four voltage lines available.
Option to connect power supply using 6.3 mm terminal type faston or M3 thread.
Choice of various widths and pitches of connectors.
Row b can be used as a 0 V reserve line, in order to minimise crosstalk on rows a and c. Contacts 1, 2, 31 and 32 are allocated via a 2.54 mm pitch connection. Other contacts can be allocated by wiring or wrapping. Rows a, b and c can be connected together using strap connectors (designed to connect DIN connector pins).
Boards feature high-quality foil laminate holes with varnish to avoid solder bridges.
PC / VME Bus Boards
PC Compatible Prototyping Boards
Prototyping boards manufactured from epoxy glass material to BS 4584 part 3 or 16. Card thickness is 1.6 mm. Copper is 305 g/m² (1 oz/ft²). Edge connector fingers are gold plated to a thickness of 1.5 microns. 1.0 mm (0.040 in.). Diameter holes are pre-drilled on a 2.54 mm (0.1 in.) matrix.
Microboard Pattern
Incorporates, on the component side of the card, a colander ground plane for maximum screening and glitch free high speed operation, and complete solder mask protection.
Specifications
Attribute | Value |
---|---|
Connection | DIN 41612 |
Number of Contacts | 96 |
Base Material | Epoxy Glass Fabric Laminate |
Number of Sides | 2 |
Height | 128.6mm |
Horizontal Pitch | 18.8HP |
Thickness | 1.6mm |
Pitch | 20.32mm |
Copper Thickness | 35µm |