TE Connectivity 1-2199298 2.54mm Pitch Straight 14 Way, Through Hole Standard Pin Ladder IC Dip Socket, 1A

Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
COO (Country of Origin): CN
Product Details

TE Connectivity DIPLOMATE Dual Leaf PCB Mount DIP Socket

DIPLOMATE Dual Leaf (DL) DIP sockets with stamped and formed dual wiping contacts for vertical, through hole PCB mounting. These DIPLOMATE Dual Leaf (DL) DIP sockets have black thermoplastic GF stackable housings with a 2.54mm centreline, and a "true closed bottom" design which prevents solder or flux wicking and standoffs to allow board clearance for cleaning after soldering. The profiles for these DIPLOMATE Dual Leaf (DL) DIP sockets are all standard apart from part number 719-8817 which has an over-the-component profile. These DIPLOMATE DIP sockets are available with different frame styles with either straight or retention legs.

Specifications
Attribute Value
Number of Contacts 14
Mounting Type Through Hole
Pin Type Standard
Pitch 2.54mm
Row Width 7.62mm
Frame Type Ladder
Termination Method Solder
Contact Plating Tin over Nickel
Current Rating 1A
Orientation Straight
Length 17.78mm
Width 10mm
Depth 5.1mm
Dimensions 17.78 x 10 x 5.1mm
Minimum Operating Temperature -40°C
Voltage Rating 250 V ac/dc
Series 1-2199298
Housing Material Glass Filled PBT, Thermoplastic
Contact Material Phosphor Bronze
Maximum Operating Temperature +105°C
Temporarily out of stock - back order for despatch 20/03/2020, delivery within 5 working days from desptach date
Price Each (In a Tube of 3400)
PHP 4.89
(exc. VAT)
PHP 5.48
(inc. VAT)
units
Per Unit
Per Tube*
3400 +
PHP4.89
PHP16,626.00
*price indicative
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