50Ω STMicroelectronics Surface Mount Chip Balun

Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
Product Details

Baluns use ST’s process integrating high-quality RF passive components on a single glass substrate. As well as balanced/unbalanced conversion, they can also integrate a matching network in a footprint smaller than 1 mm² for the complete function. ST's latest balun-the 1.2 mm² footprint BALF-NRG-02D3-is customized for our BlueNRG-1 and new BlueNRG-2 transceivers, reducing RF complexity and providing optimized link budget

The BALF-ATM-01E3 from STMicroelectronics is an integrated balun, which also integrates a matching network in a monolithic glass substrate. Matching impedance has been customized for the ATMEL chip. The device uses STMicroelectronics’ IPD technology on a non-conductive glass substrate to optimize RF performance

2.4 – 2.5 GHz balun with integrated matching network
Matching optimized for following chipsets: ATSAMR21E18
Low insertion loss
Low amplitude imbalance
Low phase imbalance
Coated CSP on glass bumpless
Small footprint 2.5 mm²

Specifications
Attribute Value
Unbalance Impedance 50Ω
Balance Impedance 50Ω
Maximum Insertion Loss 1.3dB
Mounting Type Surface Mount
Pin Count 6
Dimensions 2.1 x 1.35 x 0.455mm
Height 0.455mm
Length 2.1mm
Width 1.35mm
Maximum Frequency 2.5GHz
Minimum Frequency 2400MHz
Maximum Operating Temperature +105°C
Minimum Operating Temperature -40°C
5000 In Global stock for delivery within 4 - 8 working days
Price Each (On a Reel of 5000)
PHP 8.80
(exc. VAT)
PHP 9.86
(inc. VAT)
units
Per Unit
Per Reel*
5000 +
PHP8.80
PHP44,000.00
*price indicative
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