50Ω STMicroelectronics Surface Mount Chip Balun

Technical data sheets
Legislation and Compliance
RoHS Certificate of Compliance
Product Details

Baluns use ST’s process integrating high-quality RF passive components on a single glass substrate. As well as balanced/unbalanced conversion, they can also integrate a matching network in a footprint smaller than 1 mm² for the complete function. ST's latest balun-the 1.2 mm² footprint BALF-NRG-02D3-is customized for our BlueNRG-1 and new BlueNRG-2 transceivers, reducing RF complexity and providing optimized link budget

STMicroelectronics' BALF-CC26-05D3 is an ultra-miniature balun, integrating both matching network and harmonics filter. Matching impedance has been customized for the TI CC26xx series 5x5 SimpleLink™ multistandard wireless MCU. The device uses STMicroelectronics' IPD technology on a non-conductive glass substrate, which optimizes RF performance

2.45 GHz balun with integrated matching network
Matching optimized for CC26 series 5´5 external differential
Low insertion loss
Low amplitude imbalance
Low phase imbalance
Coated Flip-Chip on glass
Small footprint < 1.5 mm²

Specifications
Attribute Value
Unbalance Impedance 50Ω
Balance Impedance 50Ω
Maximum Insertion Loss 1.5dB
Mounting Type Surface Mount
Pin Count 5
Length 1.485mm
Maximum Frequency 2.5GHz
Minimum Frequency 2400MHz
Maximum Operating Temperature +105°C
Minimum Operating Temperature -40°C
5000 In Global stock for delivery within 4 - 8 working days
Price Each (On a Reel of 5000)
PHP 6.657
(exc. VAT)
PHP 7.456
(inc. VAT)
units
Per Unit
Per Reel*
5000 +
PHP6.657
PHP33,285.00
*price indicative
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