Solder Pastes

Solder paste is a type of solder used when manufacturing PCBs to connect surface mount components to pads on the board. The paste is a mixture of small solder spheres with flux.
The paste initially adheres components in place because of its stickiness. You then use heat to melt the paste to form a mechanical bond and an electrical connection.
Solder paste is applied to the board by stencil printing and the components are put in place by a pick and place machine or by hand.
Why use a solder paste?
Defects in circuit-board assembly are caused due to issues in the solder-paste printing process or due to defects in the solder paste. This can give short circuits, incomplete circuits, and head on pillow defects.
How to use Solder paste
• Remove oil, grease, polishing compound and any excessive oxides from the joint. Make sure that the joint is smooth, flat and free from any burs.
• Apply the solder paste to the top joint. The paste will not fill large gaps so make sure that the pieces to be soldered actually touch.
• Apply heat to the piece away from the joint, keep the heat source moving too prevent overheating the paste.
• Once the paste flows remove the heat source

Typical Applications
Solder pastes are used in mass production of PCBs and prototype PCB assembly.

...
Read more Read less

Filters

Viewing 1 - 20 of 23 products
Results per page
Description Price Lead Free Trade Name Package Type Package Size
RS Stock No. 835-2699
Mfr. Part No.SKU-0018
PHP508.80
Each
units
- Electric Paint Pen 10ml
RS Stock No. 835-2693
Mfr. Part No.SKU-0216
PHP1,419.62
Each
units
- Electric Paint Jar 50ml
RS Stock No. 832-9775
Mfr. Part No.1817240
BrandHenkel
PHP4,548.44
Each
units
Yes Loctite HF212 SAC0307 AGS Jar 500g
RS Stock No. 506-4302
Mfr. Part No.698840
BrandMulticore
PHP7,219.84
Each
units
Yes - Tub 500g
RS Stock No. 555-232
Mfr. Part No.GEL FLUX MOB 39 - SERINGUE DE 10CC
BrandMBO
PHP1,223.46
Each
units
- - Syringe 10cm³
RS Stock No. 832-9766
Mfr. Part No.1817229
BrandHenkel
PHP5,970.90
Each
units
Yes Loctite HF212 97SC AGS Jar 500g
RS Stock No. 832-9750
Mfr. Part No.1791137
BrandHenkel
PHP6,798.40
Each
units
Yes Loctite HF212 97SC DAP Jar 500g
RS Stock No. 146-6192
Mfr. Part No.SMD291SNL
BrandCHIPQUIK
PHP925.00
Each
units
Yes - Syringe 15g
RS Stock No. 146-6190
Mfr. Part No.SMD291AX250T3
BrandCHIPQUIK
PHP2,460.00
Each
units
- - Jar 250g
RS Stock No. 146-6193
Mfr. Part No.SMD291SNL10
BrandCHIPQUIK
PHP1,454.00
Each
units
Yes - Syringe 35g
RS Stock No. 146-6199
Mfr. Part No.SMDLTLFP
BrandCHIPQUIK
PHP1,035.00
Each
units
Yes - Syringe 15g
RS Stock No. 146-6191
Mfr. Part No.SMD291AX50T3
BrandCHIPQUIK
PHP813.00
Each
units
- - Jar 50g
RS Stock No. 146-6196
Mfr. Part No.SMD291SNL50T3
BrandCHIPQUIK
PHP1,073.00
Each
units
Yes - Jar 50g
RS Stock No. 146-6189
Mfr. Part No.SMD291AX10T5
BrandCHIPQUIK
PHP1,813.00
Each
units
- - Syringe 35g
RS Stock No. 146-6202
Mfr. Part No.SMDLTLFP50T3
BrandCHIPQUIK
PHP1,295.00
Each
units
Yes - Jar 50g
RS Stock No. 146-6200
Mfr. Part No.SMDLTLFP10T5
BrandCHIPQUIK
PHP1,997.00
Each
units
Yes - Syringe 35g
RS Stock No. 146-6188
Mfr. Part No.SMD291AX10
BrandCHIPQUIK
PHP1,221.00
Each
units
- - Syringe 35g
RS Stock No. 146-6197
Mfr. Part No.SMD4300AX10
BrandCHIPQUIK
PHP1,331.00
Each
units
- - Syringe 35g
RS Stock No. 146-6198
Mfr. Part No.SMD4300SNL10
BrandCHIPQUIK
PHP1,548.00
Each
units
Yes - Syringe 35g
RS Stock No. 146-6201
Mfr. Part No.SMDLTLFP250T3
BrandCHIPQUIK
PHP4,069.00
Each
units
Yes - Jar 250g
Related Products
Solder Paste in jar 50g (T3) Sn63/Pb37 no ...
Description:
Solder Paste in jar 50g (T3) Sn63/Pb37 no clean 90.25% metal. Printing speeds up to 100mm/secLong stencil lifeWide process windowClear residueLow voidingExcellent wetting compatibility on most board finishesPrint gradeCompatible with enclosed print headsPasses BONO test.
Solder Paste in jar 50g (T3) Sn42/Bi57.6/Ag0.4 Low ...
Description:
Solder Paste in jar 50g (T3) Sn42/Bi57.6/Ag0.4 Low Temperature 90% metal melts @ 138C, 281F. Printing speeds up to 100mm/secLong stencil lifeWide process windowClear residueLow voidingExcellent wetting compatibility on most board finishesPrint gradeCompatible with enclosed print headsRoHS II and REACH ...
Lead-free fine grade solder paste for stencil printing ...
Description:
Lead-free fine grade solder paste for stencil printing applications down to 0.4mm (16 thou) pitch. Clear residue which meets Bellcore TRW-NWT-000078 without post-solder cleaningCan be printed up to 150mm/sNet weight 500 g.
No-Clean solder paste suitable for stencil printing for ...
Description:
No-Clean solder paste suitable for stencil printing for reflow processes.Fine pitch capability (400 μm).High activity.Minimal residue, neutral and colourless.Chlorine-free.